D20 Datasheet



Features, Applications

Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: � Support for the chip � Electrical contacts � Suitable embedding interface for gluing the module to the plastic package

Physical dimensions and contact positions compliant to the ISO 7816 standard

Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.)

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel.

Table 1. Memory Card and Memory Tag Integrated Circuits

Module C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules M35101, M35102

Type M35101 M35102 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM Contactless Memory Chip with 64-bit Unique ID, 13.56 MHz, 2048 bit EEPROM Memory Card IC, 272 bit High Endurance EEPROM with Advanced Security Mechanisms Description (please see the individual product data sheets for full specifications) Memory Card IC, 2 Kbit x 8) Serial I2C Bus EEPROM Memory Card IC, 4 Kbit Serial I2C Bus EEPROM Memory Card IC, 16 Kbit Serial I2C Bus EEPROM Memory Card IC, 32 Kbit Serial I2C Bus EEPROM Memory Card IC, 64 Kbit Serial I2C Bus EEPROM Memory Card IC, 128 Kbit Serial I2C Bus EEPROM Memory Card IC, 256 Kbit Serial I2C Bus EEPROM Memory Card IC, 256 bit OTP EPROM with Lock-Out Memory Card IC, 192 bit High Endurance EEPROM with Secure Logic Access Control Process 0.6 �m Technology CMOS NMOS CMOS Module Style C20, C30

The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending on product) The range of products and types of Micromodule are summarized in Table 1 and Table 2. For large volumes, ST is able to offer customized module tape. DELIVERY The Super 35mm metallized epoxy tape is delivered on reels, as shown in Figure 1. These contain all of the chips from a number of wafers, including those chips that were found to be nonfunctioning during testing. Traceability is ensured by a label fixed on the reel. The typical quantity is 10,000 modules per reel, with priority given to lot integrity on the reel. The maximum quantity is 15,000 per reel. Parts which are faulty (mechanically or electrically defective) are identified by punch holes. The specification for the reject punch holes is shown in

Figure 4 for the D10 micromodule, in Figure 5 for the D15 micromodule, in Figure 6 for the D20 micromodule, and in Figure 7 for the D22 micromodule. Tape joins (tape splicing) are never more than 10 per 10 metre length, as shown in Figure 2 and Figure 3. At least m of leader, and m of trailer is included on each reel. Each is made of PVC Super 35 mm tape, without metalisation, and is opaque to infrared and white light. A "failure" marking of reject holes is included at the beginning and end of the tape of a minimum of 5 consecutive module pitches (double positions). Modules should be stored within the temperature range + 85 �C, for no more than 1 year. Each reel is packed in an antistatic bag, along with a desiccant bag, and a humidity indicator card. This card indicates the level of humidity as follows: 30 - Blue: protection assured 40 - Pink: renew the desiccant bag 50 - Pink: protection no longer ensured Three self adhesive plastic identification labels are attached: one to the reel, one to the antistatic bag,

Table 3. Manufacturing Flow and Manufacturing Facility Locations

Operation Rousset, France. 6" wafer fab. Wafer Diffusion Agrate, Italy. 6" wafer fab.: standard EEPROM only Rousset, France. Electrical Wafer Test Agrate, Italy: standard EEPROM only Assembly Final Test Casablanca, Morocco. Casablanca, Morocco. Rousset, France. Location and Facility

Material Tape Basic material Adhesive Laminated copper foil Adhesive strength Tape Surface roughness Contact surface Nickel thickness Gold thickness Total tape thickness Control, Palmer MCTS T2 or IBIDEN rough, typical thickness 120 �m Modified epoxy, typical thickness 18 �m Typical thickness > 0.8 N/mm at room temperature. Monitored by the tape manufacturer using appropriate test methods The whole epoxy adhesive surface is controlled to be free of dirt, grease, cleaning compounds and parting compounds Typically Rz: �m at first accepted delivery Nickel-gold, galvanised treatment 2 �m (min.) contact side, 0.1 �m (min.) 30 �m "Special flat" diameter 3 mm, 1.5 N Chip Interconnect Dice bonding Bonding wire Ring (D22 only) Silver epoxy Gold 25 �m Bronze Protective coating Material Assembly UV epoxy, Black epoxy Casablanca, Morocco. Description



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