D2511D Datasheet



Features, Applications


Integrated optical isolator SONET/SDH compatible to OC-48/STM-16 High-performance, multiquantum-well (MQW), distributed-feedback (DFB) laser Low dispersion penalty for long-reach and extended-reach applications Industry-standard, 14-pin butterfly package Characterized at 2.488 Gb/s (NRZ) Wide operating case temperature range +70 �C InGaAs, PIN photodetector back-facet monitor Low threshold current High reliability High optical power available Qualified to meet the intent of Telcordia TechnologiesTM 468

The �m D2500-Type Laser Module is offered a 14-pin, hermetic, butterfly package.
Telecommunications: SONET/SDH Long reach Interexchange Digital video

The minimum pigtail length is 39.4 in. (100 cm); the minimum bend radius is 1.23 in. (31.25 mm). The pigtail 900 �m tight buffer fiber. Various connector and pigtail options are available. Optoelectronic components produced by TriQuint are qualified to rigorous internal standards that are consistent with Telcordia Technologies TR-NWT-000468. All design and manufacturing operations are ISO � 9001 certified. The module is fully qualified for central office applications.


The D2500-type digital isolated DFB laser module contains an internally cooled, InGaAsP, MQW, distributedfeedback (DFB) laser designed for 1.5 �m applications. The laser is designed to be used OC-12/STM-4 (622 Mb/s) and OC-48/STM-16 (2.488 Gb/s) for longreach and extended-reach applications. It is also capable of low dispersion penalties (<2 dB) for use with fiber spans exceeding km (3000 ps/nm). The device is available with an average output power of 0 dBm (3 dBm peak), which meets the SONET/SDH standard. To eliminate the need for optical amplifiers in some applications, the module can also be ordered with higher output powers.

Pin 1 Thermistor Laser dc Bias (cathode) Back-facet Monitor Anode Back-facet Monitor Cathode Thermoelectric Cooler Thermoelectric Cooler Case Ground Case Ground Case Ground Laser Anode RF Laser Input Cathode Laser Anode Case Ground Name

The module contains an internal optical isolator that suppresses optical feedback in laser-based, fiber-optic systems. Light reflected back to the laser is attenuated a minimum of 30 dB.

An integral thermoelectric cooler (TEC) provides stable thermal characteristics. The TEC allows for heating and cooling of the laser chip to maintain a temperature 25 �C for case temperatures from to +70 �C. The laser temperature is monitored by the internal thermistor, which can be used with external circuitry to control the laser chip temperature.

An internal, InGaAs, PIN photodiode functions as the back-facet monitor. The photodiode monitors emission from the rear facet of the laser and, when used in conjunction with control circuitry, can control optical power launched into the fiber. Normally, this configuration is used in a feedback arrangement to maintain the average laser output power.

* A positive current through the thermoelectric heat pump cools the laser. Both leads should be grounded for optimum performance.

The laser module is fabricated a 14-pin, hermetic, metal/ceramic butterfly package. The package also incorporates a bias tee that separates the dc-bias path from the RF input. The RF input has a nominal 25 impedance. The laser module is equipped with a single-mode fiber with 8 �m core and 125 �m cladding.

For additional information and latest specifications, see our website: www.triquint.com

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Laser Reverse Voltage dc Forward Current Operating Case Temperature Range Storage Case Temperature Range* Photodiode Reverse Voltage Photodiode Forward Current


To avoid the possibility of damage to the laser module from power supply switching transients, follow this turnon sequence: 1. All ground connections 2. Most negative supply 3. Most positive supply 4. All remaining connections Reverse the order for the proper turn-off sequence. Electrostatic Discharge CAUTION: This device is susceptible to damage as a result of electrostatic discharge. Take proper precautions during both handling and testing. Follow guidelines such as JEDEC Publication No. 108-A (Dec. 1988). TriQuint employs a human-body model (HBM) for ESDsusceptibility testing and protection-design evaluation. ESD voltage thresholds are dependent on the critical parameters used to define the model. A standard HBM (resistance 1.5 k, capacitance = 100 pF) is widely used and can be used for comparison purposes.

The minimum fiber bend radius mm (1.23 in.). To avoid degradation in performance, mount the module on the board as follows: 1. Place the bottom flange of the module on a flat heat sink at least 0.5 in. x 1.180 in. x 30 mm) in size. The surface finish of the heat sink should be better than 32 �in. (0.8 �m), and the surface flatness must be better than 0.001 in. (25.4 �m). Using thermal conductive grease is optional; however, thermal performance can be improved 5% if conductive grease is applied between the bottom flange and the heat sink. 2. Mount four #2-56 screws with Fillister heads (M2-3 mm) at the four screw-hole locations (see Outline Diagram). The Fillister head diameter must not exceed 0.140 in. (3.55 mm). Do not apply more than 1 in.-lb. of torque to the screws.



Manufacturer information

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