HomedatasheetDAC0832LJ

DAC0832LJ Datasheet

8-bit P Compatible, Double-buffered D to a Converters
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Description

Features, Applications

The is an advanced CMOS/Si-Cr 8-bit multiplying DAC designed to interface directly with the � , and other popular microprocessors. A deposited silicon-chromium R-2R resistor ladder network divides the reference current and provides the circuit with excellent temperature tracking characteristics (0.05% of Full Scale Range maximum linearity error over temperature). The circuit uses CMOS current switches and control logic to achieve low power consumption and low output leakage current errors. Special circuitry provides TTL logic input voltage level compatibility. Double buffering allows these DACs to output a voltage corresponding to one digital word while holding the next digital word. This permits the simultaneous updating of any number of DACs. The DAC0830 series are the 8-bit members of a family of microprocessor-compatible DACs (MICRO-DACTM).

Features

n Double-buffered, single-buffered or flow-through digital data inputs n Easy interchange and pin-compatible with 12-bit DAC1230 series n Direct interface to all popular microprocessors n Linearity specified with zero and full scale adjust only NOT BEST STRAIGHT LINE FIT. n Works with � 10V reference-full 4-quadrant multiplication n Can be used in the voltage switching mode n Logic inputs which meet TTL voltage level specs (1.4V logic threshold) n Operates "STAND ALONE" (without �P) if desired n Available in 20-pin small-outline or molded chip carrier package

Current settling time: 1 �s Resolution: 8 bits Linearity: or 10 bits (guaranteed over temp.) Gain Tempco: 0.0002% FS/�C Low power dissipation: 20 mW Single power supply: to 15 VDC

BI-FETTM and MICRO-DACTM are trademarks of National Semiconductor Corporation. is a registered trademark of Zilog Corporation.

(Top Views) Molded Chip Carrier Package

If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) Voltage at Any Digital Input Voltage at VREF Input Storage Temperature Range Package Dissipation = 25�C (Note 3) DC Voltage Applied or IOUT2 (Note 4) ESD Susceptability (Note 4) 17 VDC VCC to GND mV to VCC 800V

Lead Temperature (Soldering, 10 sec.) Dual-In-Line Package (plastic) Dual-In-Line Package (ceramic) Surface Mount Package Vapor Phase (60 sec.) Infrared (15 sec.)

Temperature Range Part numbers with "LCN" suffix Part numbers with "LCWM" suffix Part numbers with "LCV" suffix Part numbers with "LCJ" suffix Part numbers with "LJ" suffix Voltage at Any Digital Input TMINTATMAX to +125�C VCC to GND

VREF = 10.000 VDC unless otherwise noted. Boldface limits apply over temperature, TMINTATMAX. For all other limits = 25�C.

CONVERTER CHARACTERISTICS Resolution Linearity Error Max DAC0830LJ & LCJ DAC0832LJ & LCJ DAC0830LCN, LCWM & LCV DAC0831LCN DAC0832LCN, LCWM & LCV Differential Nonlinearity Max DAC0830LJ & LCJ DAC0832LJ & LCJ DAC0830LCN, LCWM & LCV DAC0831LCN DAC0832LCN, LCWM & LCV Monotonicity Gain Error Max Gain Error Tempco Max Power Supply Rejection -10VVREF +10V Using Internal Rfb -10VVREF+10V Using internal Rfb All digital inputs latched high VCC to 5.5V Reference Input Max Min VREF = 20 Vp-p, = 100 kHz All data inputs latched low k mVp-p 0.0025 % FSR/V 0.0006 % FS/�C LJ & LCJ LCN, LCWM & LCV 7 4 Zero and full scale adjusted -10VVREF+10V FSR % FSR % FSR % FSR % FSR bits 4, 8 Zero and full scale adjusted -10VVREF+10V FSR % FSR % FSR % FSR % FSR 4, 8 bits


Features

Parameters

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Manufacturer information

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