FEATURES 1 LSB Differential Linearity (max) Guaranteed Monotonic Over Temperature Range 2 LSB Integral Linearity (max) 500 ns Settling Time 5 mA Full-Scale Output TTL/CMOS Compatible Low Power: 190 mW (typ) Available in Die Form APPLICATIONS Communications ATE Data Acquisition Systems High Resolution Displays
The a 16-bit high speed current-output digital-toanalog converter with a settling time of 500 ns. A unique combination of low distortion, high signal-to-noise ratio, and high speed make the DAC16 ideally suited to performing waveform synthesis and modulation in communications, instrumentation, and ATE systems. Input reference current is buffered, with fullscale output current of 5 mA. The 16-bit parallel digital input bus is TTL/CMOS compatible. Operating from +5 V and �15 V supplies, the DAC16 consumes 190 mW (typ) and is available a 24-lead epoxy DIP, epoxy surface-mount small outline (SOL), and in die form.Figure 1. DAC16 Settling Time Accuracy vs. Percent of Full Scale
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 � Analog Devices, Inc., 1999
ELECTRICAL CHARACTERISTICS perature Range unless otherwise noted. See Note 1 for supply variations.)
Integral Linearity "G" Integral Linearity "G" Differential Linearity "G" Differential Linearity "G" Integral Linearity "F" Integral Linearity "F" Differential Linearity "F" Differential Linearity "F" Zero Scale Error Zero Scale Drift Gain Error Gain Drift REFERENCE2 Reference Input Current OUTPUT CHARACTERISTICS Output Current Output Capacitance Settling Time LOGIC CHARACTERISTICS Logic Input High Voltage Logic Input Low Voltage Logic Input Current Logic Input Current Logic Input Current Input Capacitance SUPPLY CHARACTERISTICS Power Supply Sensitivity Positive Supply Current Positive Supply Current Negative Supply Current Power DissipationINL DNL INL DNL ZSE TCZSE GE TCGE IREF IOUT COUT tS VINH VINL IINH IINL CIN PSS ICC IEE PDISS
NOTES 1 All supplies can be varied � 5% and operation is guaranteed. Device is tested with nominal supplies. 2 Operation is guaranteed over this reference range, but linearity is neither tested not guaranteed (see Figures 7 and 8). Specifications subject to change without notice.
Integral Nonlinearity Differential Nonlinearity Zero Scale Error Gain Error Logic Input High Voltage Logic Input Low Voltage Logic Input Current Positive Supply Current Negative Supply Current Power Dissipation
NOTE Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.
VCC to VEE. +25.0 V VCC to DGND. +7.0 V VEE to AGND. �18.0 V DGND to AGND. +0.3 V REF GND to AGND. +1.0 V IREF. 1 mA Analog Output Current. 8 mA Digital Input Voltage to DGND. VCC Operating Temperature Range FP, FS. to +85�C GS. to +70�C Dice Junction Temperature. +150�C Storage Temperature. to +150�C Power Dissipation. 1000 mW Lead Temperature (Soldering, 60 sec). +300�C
1. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to the above maximum rating conditions for extended periods may affect device reliability. 2. Digital inputs and outputs are protected; however, permanent damage may occur on unprotected units from high energy electrostatic fields. Keep units in conductive foam or packaging at all times until ready to use. Use proper antistatic handling procedures. 3. Remove power before inserting or removing units from their sockets.
NOTE JA is specified for worst case mounting conditions, i.e., JA is specified for device in socket.Description
Die Size x 0.153 inch, 19,737 sq. mils x 3.886 mm, 12.73 sq. mm) The DAC16 Contains 330 Transistors. Substrate is VEE Polarity.
Reference Current Input Digital Ground +5 V Digital Supply 16-Bit Digital Input Bus. DB15 is the MSB. �15 V Analog Supply Reference Current Return Analog Ground/Output Reference Current Output Current Ladder CompensationORDERING GUIDE Model Grade DNL (max) Temperature Ranges Package Descriptions Package Options
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