Dual, Serial Input 16-Bit Multiplying Digital-to-Analog Converter
Relative Accuracy: 1 LSB Max Differential Nonlinearity: 1 LSB Max 2-mA Full-Scale Current �20%, with VREF 0.5 �s Settling Time Midscale or Zero-Scale Reset Separate 4Q Multiplying Reference Inputs Reference Bandwidth: 10 MHz Reference Dynamics: �105 dB THD SPITM-Compatible 3-Wire Interface: 50 MHz Double Buffered Registers Enable Simultaneous Multichannel Change Internal Power On Reset Industry-Standard Pin ConfigurationDESCRIPTION
The is a dual, 16-bit, current-output digital-to-analog converter (DAC) designed to operate from a single +5.5 V supply. The applied external reference input voltage VREF determines the full-scale output current. An internal feedback resistor (RFB) provides temperature tracking for the full-scale output when combined with an external I-to-V precision amplifier. A double-buffered, serial data interface offers high-speed, 3-wire, SPI and microcontroller compatible inputs using serial data in (SDI), clock (CLK), and a chip-select (CS). A common level-sensitive load DAC strobe (LDAC) input allows simultaneous update of all DAC outputs from previously loaded input registers. Additionally, an internal power-on reset forces the output voltage to zero at system turn-on. An MSB pin allows system reset assertion (RS) to force all registers to zero code when MSB or to half-scale code when MSB = 1. The DAC8812 is available an TSSOP-16 package.APPLICATIONS
Automatic Test Equipment Instrumentation Digitally Controlled Calibration
RFBA 16 Input Register R DAC A Register R DAC A IOUTA AGNDA
RFBB Input Register R DAC B Register R DAC B IOUTB AGNDB
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SPI is a trademark of Motorola, Inc. All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION (1)
MINIMUM RELATIVE ACCURACY (LSB) �1 �2 DIFFERENTIAL NONLINEARITY (LSB) �1 SPECIFIED TEMPERATURE RANGE to +85�C PACKAGELEAD TSSOP-16 PACKAGE DESIGNATOR PW ORDERING NUMBER DAC8812IBPW DAC8812IBPWR TRANSPORT MEDIA, QUANTITY Tube, 90 Tape and Reel, 2500 Tube, 90 Tape and Reel, 2500
For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or see the TI website at www.ti.com.
DAC8812 VDD to GND VREF to GND Logic inputs and output to GND V(IOUT) to GND AGNDX to DGND Input current to any pin except supplies Package power dissipation Thermal resistance, JA Maximum junction temperature (TJmax) Operating temperature range Storage temperature range 0.3 to VDD +0.3 �50 (TJmax � TA)/JA to +150 UNIT mA W �C/W �C
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
VDD 5.5 V, IOUTX = Virtual GND, AGNDX 0 V, VREFA, TA = full operating temperature range, unless otherwise noted.
DAC8812 PARAMETER STATIC PERFORMANCE (2) Resolution Relative accuracy Differential nonlinearity Output leakage current Full-scale gain error Full-scale tempco (3) Feedback resistor REFERENCE INPUT VREFX range Input resistance Input resistance match Input capacitance (3) ANALOG OUTPUT Output current Output capacitance (3) LOGIC INPUTS AND OUTPUT Input low voltage Input high voltage Input leakage current Input capacitance (3) Logic output low voltage Logic output high voltage INTERFACE TIMING (3), (4) Clock width high Clock width low CS to Clock setup Clock to CS hold Clock to SDO prop delay Load DAC pulsewidth Data setup Data hold Load setup Load hold tCH tCL tCSS tCSH tPD tLDAC tDS tDH tLDS tLDH ns VIL VIH IIL CIL VOL VOH IOL 1.6 mA IOH �A 4 VDD +2.7 V VDD +5 V VDD +2.7 V VDD pF V IOUTX COUTX Data = FFFFh Code-dependent mA pF VREFX RREFX CREFX Channel-to-channel % pF INL DNL IOUTX GFSE TCVFS RFBX VDD DAC8812C DAC8812 Data = +25�C Data = TA max Data = FFFFh Bits LSB nA mV ppm/�C k SYMBOL CONDITIONS MIN TYP MAX UNIT
Specifications subject to change without notice. All static performance tests (except IOUT) are performed in a closed-loop system using an external precision OPA277 I-to-V converter amplifier. The DAC8812 RFB terminal is tied to the amplifier output. Typical values represent average readings measured at +25�C. These parameters are specified by design and not subject to production testing. All input control signals are specified with 3 V) and timed from a voltage level 1.5 V.