D Pin-For-Pin compatibility with to 12-V Single Supply to "6-V Dual Supply Operation D Lower On-Resistance: rDS(on) 17 W Typ. D Fast Switching: tON - 38 ns, tOFF ns D Break-Before-Make Guaranteed D Low Leakage: IS(off) 0.2 nA Max. D Low Charge Injection: pC D TTL, CMOS, LV Logic (3 V) Compatible -82 dB Off-Isolation at 1 MHz D 2000-V ESD Protection (HBM)
High Accuracy Single and Dual Power Rail Capacity Wide Operating Voltage Range Simple Logic InterfaceAPPLICATIONS
Data Acquisition Systems Battery Operated Equipment Portable Test Equipment Sample and Hold Circuits Communication Systems SDSL, DSLAM Audio and Video Signal RoutingDESCRIPTION
The DG408L/409L are low voltage pin -for-pin compatible companion devices to the industry standard DG408/409 with improved performance. Using BiCMOS wafer fabrication technology allows the DG408L/409L to operate on single and dual supplies. Single supply voltage ranges from to 12-V while dual supply operation is recommended with "6 V. The an 8-channel single-ended analog multiplexer designed to connect one of eight inputs to a common output as determined a 3-bit binary address A1, A2). The is a dual 4-channel differential analog multiplexer designed to connect one of four differential inputs to a common dual output as determined by its 2-bit binary address (A0, A1). Break-before-make switching action to protect against momentary crosstalk between adjacent channels. The DG408L/409L provides lower on-resistance, faster switching time, lower leakage, less power consumption and higher off-Isolation than the DG408/409.
For low and high voltage levels for VAX and VEN consult "Digital Control" parameters for specific V+ operation.
Voltage Referenced to VV+. 14 V GND. 7 V Digital Inputsa, VS, VD. (V- V to (V+) +0.3 V Current (Any Terminal). 30 mA Peak Current, or D (Pulsed at 1 ms, 10% Duty Cycle Max). 100 mA Storage Temperature: (A Suffix). 150_C (D Suffix). to 125_C Power Dissipation (Package)b 16-Pin Plastic TSSOPc. mW 16-Pin Narrow SOICc. mW 16-Pin CerDIPd. 750 mW Notes a. Signals on SX, DX, Ax, or EN exceeding or V- will be clamped by internal diodes. Limit forward diode current to maximum current ratings. b. All leads soldered or welded to PC board. c. Derate 7.6 mW/_C above 75_C. d. Derate 12 mW/_C above 75_C. e. Derate 10 mW/_C above 75_C.Test Conditions Unless Otherwise Specified Parameter Analog Switch
Analog Signal Rangee Drain-Source On-Resistance rDS(on) Matching Between Channelsg On-Resistance Flatnessi VANALOG rDS(on) DrDS rFLAT(on) IS(off) Switch Off Leakage Current ID(off) Channel On Leakage Current ID(on) VEN 10 mA Sequence Each Switch 10 mA Room Full Room Full Room Full nA Full Room Full Room W V
Logic High Input Voltage Logic Low Input Voltage Input Current VINH VINL IIN VAX = VEN 0.8 V Full V mA
Transition Time Break-Before-Make Time Enable Turn-On Time Enable Turn-Off Time Charge Injectione Off Isolatione, h Crosstalke Source Off Capacitancee Drain Off Capacitancee Drain On Capacitancee tTRANS tOPEN tON(EN) tOFF(EN) Q OIRR XTALK CS(off) CD(off) CD(on) V, (DG409L) See Figure 2 VS(all) = VDA 5 V, See Figure 4 VAX V (DG408L) VAX V (DG409L) See Figure = 1 nF, VGEN 0 V, RGEN 100 kHz, kHz = 1 MHz, 0 V, VEN MHz, 2.4 V, VEN MHz, 0 V, VEN V (DG409L only) Room Full Room Full Room Full Room Full Room 60 65Power Supply Range Power Supply Current V+ I+ VEN 5 V Room V mA