HomedatasheetIRFBC30S

IRFBC30S Datasheet

MOSFET
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Description

The IRFBC30S is Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.The D2Pak is a surface mount power package capable of the accommodatingdie sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRFBC30S) is available for low-profile applications. IRFBC30S Features • Surface Mount (IRFBC30S)• Low-profile through-hole (IRFBC30L)• Available in Tape & Reel (IRFBC30S)• Dynamic dv/dt Rating• 150°C Operating Temperature• Fast Switching• Fully Avalanche Rated
Features

Parameters

[{"Name":"Transistor Polarity","Value":"N-Channel "},{"Name":"Drain-Source Breakdown Voltage","Value":"600 V "},{"Name":"Gate-Source Breakdown Voltage ","Value":"+/- 20 V "},{"Name":"Continuous Drain Current ","Value":"3.6 A "},{"Name":"Resistance Drain-Source RDS (on)","Value":"2.2 Ohms "},{"Name":"Configuration ","Value":"Single "},{"Name":"Maximum Operating Temperature","Value":"+ 150 C "},{"Name":"Mounting Style","Value":"SMD/SMT"},{"Name":"Package / Case","Value":"D2PAK "},{"Name":"Packaging","Value":"Tube "}]

Manufacturer information

JIEJIE MICROELECTRONICS CO.,LTD
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