The UPA810TF contains two NE856 NPN high frequency silicon bipolar chips. NEC's new low profile TF package is ideal for all portable wireless applicatons where reducing compo nent height is a prime consideration. Each transistor chip is independently mounted and easily configured for two stage cascade LNAs and other similar applications.
• SMALL PACKAGE OUTLINE:
SOT-363 package measures just 2 mm x 1.25 mm
• LOW HEIGHT PROFILE: Just 0.60 mm hight
• HIGH COLLECTOR CURRENT: ICMAX = 100 mA